As a crucial carrier for the storage and transportation of electronic components, the anti-static performance of PE circuit board parts packaging trays directly affects the reliability of sensitive components such as circuit boards. The core of anti-static design lies in constructing a complete static dissipation path through material selection, structural optimization, and process control, avoiding the risk of discharge caused by charge accumulation. The following systematically elaborates on the key structural design points of PE circuit board parts packaging trays from seven dimensions: material properties, surface structure, internal conductive channels, environmental adaptability, manufacturing process, usage specifications, and testing and maintenance.
While PE material itself possesses chemical stability and weather resistance, its anti-static performance needs to be improved through modification. Pure PE has a high surface resistivity and easily accumulates static electricity; therefore, conductive additives (such as carbon black, metal powder, or conductive polymers) or anti-static agents (such as surfactants) need to be added. Conductive additives reduce resistivity by forming a continuous conductive network, while anti-static agents reduce surface resistance through hygroscopicity. For example, adding 5%-10% conductive carbon black to a PE composite material can reduce the surface resistivity from 10¹⁶Ω to 10⁶-10⁹Ω, meeting anti-static requirements. Simultaneously, it is essential to ensure a uniform distribution of material composition to avoid uneven electrostatic dissipation caused by localized resistance differences.
The surface structure of the tray significantly impacts its anti-static performance. A rough surface increases the contact area with the circuit board, promoting charge transfer, while specific textures (such as diamond or grid patterns) optimize the electrostatic dissipation path. For example, a PE tray with a micron-level uneven surface reduces contact resistance, making it easier for static electricity to be conducted to the grounding device. Furthermore, chamfered or rounded edges prevent tip discharge, further reducing the risk of electrostatic discharge. Surface treatment processes (such as corona treatment or plasma treatment) can increase the surface energy of the material, enhance the adhesion of conductive coatings, and ensure stable anti-static performance during long-term use.
Internal conductive channels are crucial for the anti-static design of the tray. Multi-layered composite structures (such as alternating layers of PE substrate and conductive layers) or grid-like conductive channels (such as embedded metal wires or conductive fibers) increase the conductive area and improve conductivity. For example, embedding an aluminum foil grid or carbon fiber cloth at the bottom of the tray creates a low-resistance path, allowing static electricity to be quickly discharged. Furthermore, a specially designed conductive layer (such as a PE coating containing conductive particles) ensures that the pallet retains its conductivity even after wear or scratches, preventing antistatic failure due to localized damage.
Environmental factors significantly impact the antistatic performance of pallets. Excessive humidity can lead to a decrease in surface resistance, while extreme temperatures (high-temperature softening or low-temperature embrittlement) can damage the material structure. Therefore, material modification is necessary to improve environmental adaptability. For example, adding weather-resistant additives (such as UV absorbers) can extend the pallet's lifespan, while selecting a PE substrate with a higher melting point (such as HDPE) can prevent high-temperature deformation. Additionally, pallet design must consider ventilation structures to prevent static electricity accumulation in humid environments, and a sealed design prevents dust contamination of the circuit board.
The manufacturing process directly affects the stability of the pallet's antistatic performance. Injection molding processes require controlled temperature and pressure to ensure uniform dispersion of conductive additives, avoiding localized aggregation or absence. Hot pressing processes require optimized heating time and pressure parameters to prevent material delamination or bubble formation. Furthermore, the bonding process between the pallet and the conductive layer (such as co-extrusion or bonding) must ensure interfacial bonding strength to prevent the conductive layer from detaching during long-term use. For example, using a co-extrusion process to integrally mold the conductive layer with the PE substrate can significantly improve the durability of antistatic performance.
Proper use and maintenance are crucial for ensuring the antistatic performance of pallets. Pallets should be kept away from sharp objects to prevent scratching the conductive layer; stacking height should be controlled to avoid excessive compression and deformation; antistatic cloths should be used for cleaning to avoid static electricity generated by friction with ordinary cloths. Furthermore, the surface resistance of pallets should be tested regularly to ensure it meets antistatic standards (e.g., 10⁶-10⁹Ω), and aged or damaged pallets should be replaced promptly.
The reliability of antistatic performance requires rigorous testing and maintenance verification. After production, pallets must undergo surface resistance testing, electrostatic decay testing, and abrasion resistance testing to ensure they meet industry standards (e.g., IEC 61340 or ANSI/ESD S20.20). During use, the pallet surface should be cleaned regularly to prevent dust or oil from affecting conductivity, and the grounding device should be checked for reliable connection to ensure timely discharge of static electricity. Systematic testing and maintenance can extend the lifespan of pallets and ensure the safe storage and transportation of sensitive components such as circuit boards.
