PE circuit board parts packaging trays, with their excellent moisture resistance, pressure resistance, electrostatic protection, and customized structural design, become the "exclusive safe haven" for electronic components throughout the entire chain from
Avoid using right-angle transitions or flat structures, and instead use rounded corners and streamlined grooves to reduce cleaning difficulty and chemical residue.
The injection molding process requires control of temperature and pressure to ensure uniform dispersion of conductive additives and avoid local aggregation or absence.
In the highly sophisticated electronics manufacturing and semiconductor supply chain, a tiny chip can be incredibly valuable.
Blister packaging PET mobile phone frame parts packaging trays, with their core capability of "precision fitting and frictionless delivery," play an indispensable yet often overlooked "invisible guardian" role in logistics and the supply chain.
Improving the positioning accuracy of PE circuit board parts packaging trays in blister packaging requires coordinated optimization from five aspects: materials, structure, mold, process, and testing.