Optimizing the shock absorption of PS chip parts packaging trays requires comprehensive consideration from multiple dimensions, including material properties, structural design, process details, and supporting protective measures, to achieve all-round protection for precision components during transportation and storage.
While PS material itself possesses a certain degree of toughness, direct use in shock-absorbing structures can easily lead to cracking or deformation due to localized stress concentration. Therefore, it is necessary to enhance its impact resistance through modification, such as adding rubber particles or nanofillers to form composite materials, thereby improving the material's elongation at break and energy absorption capacity.
Simultaneously, the main structure of the tray can adopt a double-layer hollow design, filled with a honeycomb or wave-shaped support frame. The cavity structure disperses impact force, preventing excessive stress at a single point. For example, a patented technology extends the impact force transmission path and improves attenuation efficiency during drop tests by setting longitudinal reinforcing ribs and transverse buffer grooves on the tray sidewalls.
Precise positioning of the chip slots is crucial for shock-absorbing design. Traditional flat trays are prone to edge collisions due to chip slippage, while the optimized structure requires anti-static elastic rubber pads on the inner walls of the slots, using the material's own deformation to fix the chip position. The surface of the rubber pad can be micro-textured to increase friction, while its elastic modulus must match the weight of the chip to avoid it being too soft, leading to fixation failure, or too hard, damaging the component. Furthermore, a tapered groove can be designed at the bottom of the chip slot to allow gravity to allow the chip to naturally sink to the center position, reducing the risk of displacement during transport.
Stacking protection must balance structural strength and cushioning performance. When pallets are stacked, the weight of the upper pallet is directly transferred to the lower chip through the bottom; therefore, multiple layers of cushioning structures are required at the stacking contact surface. For example, a high-resilience silicone pad can be embedded in the bottom of the pallet, the thickness of which needs to be adjusted according to the stacking height,
ensuring that the pressure on each chip layer is below the material's yield strength. Simultaneously, limiting plates can be added to the sidewalls of the stacking slot to restrict lateral displacement of the pallet and prevent localized stress concentration due to misalignment. A company's practice shows that adopting this design reduced the chip breakage rate during five-layer stacked transport.
A synergistic design of anti-static and moisture-proof measures can prevent secondary damage. Electrostatic discharge (ESD) can cause internal circuitry breakdown in chips, while humid environments accelerate the oxidation of metal pins. Therefore, tray materials must possess permanent anti-static properties and achieve stable volume resistivity through surface coatings or conductive fibers. For moisture protection, a hydrophobic coating can be sprayed onto the inner wall of the tray, or a desiccant bag can be embedded to absorb moisture from the sealed environment. For example, a medical chip tray uses a silicone sealing strip between the cover and base, along with a built-in humidity indicator card, to monitor humidity throughout the transportation process.
Transportation simulation verification is a crucial step in optimizing the design. Computer-aided engineering (CAE) simulations of vibration, impact, and drop scenarios under different road conditions can identify structural weaknesses in advance. For example, when performing finite element analysis on the tray, special attention should be paid to stress concentration areas such as chip slot corners and stacking slot connections. Wall thickness or reinforcing rib layout should be adjusted based on simulation results. In actual testing, drop tests, vibration table tests, and stacking tests must be performed according to standards to ensure that design parameters meet industry requirements.
Modular design can improve tray adaptability and maintenance efficiency. For chips of different sizes, the tray can be designed with a detachable partition structure, allowing for quick switching of slot types by adjusting the partition positions. For example, a general-purpose tray, by setting multiple sets of snap-on partitions, is compatible with various packaging forms, reducing operational risks caused by tray replacement. Simultaneously, the tray edges can have pre-reserved label slots and RFID chip mounting positions for information management and traceability.
The shockproof optimization of PS chip parts packaging trays needs to be based on material modification, constructing a multi-layered protection system through precise positioning, stacking protection, environmental control, simulation verification, and modular design. In practical applications, it is necessary to combine chip characteristics, transportation scenarios, and cost constraints to balance protective performance and production efficiency, ultimately achieving the transformation from laboratory design to large-scale application.
